The model BS281E-V was specially developed for the fast and highly precise loading of small batch sizes. The model is equipped with an optical centering system that enables image processing directly on the placement head "Vision on the Fly". It guarantees the optimal measurement of SMD components such as 0201, SOIC, PLCC, BGA, uBGA, CSP & QFP as well as odd-form components up to a grid of 0.5 mm.
Alignment "on the Fly"
Using a sophisticated camera and prism mechanism, components up to 16x14mm footprint are measured directly on the head. This eliminates the trip to the stationary camera.
Large Components
Components larger than 16x14mm are measured using an optional "bottom vision" camera. Component sizes up to 150x100mm are possible on this stationary camera.
Flexible equipment
The removal area can be equipped with any number of different feed units. From auto tape feeders to IC trays.
Easy programming
Different methods are available for programming. Tailored to your needs using Teach-In or CAD conversion. Of course, a barcode system can also be used.
SPECIFICATIONS
BS281E-V
Number of heads (Vision on the Fly): 1
Placement rate: 3000 cph, 2500 cph (IPC 9850)
Feeder capacity (8mm): up to 64 Tape Feeder
IC Tray capacity: up to 3 Waffle Trays
Component sense: vision detection
Component size:
handle by digital head camera:
smallest: 0.6 x 0.3mm
largest: 150 x 100mm
handle by fixed digital bottom vision camera:
largest: 150 x 100mm
Resolution:
X/Y axis: 0.005mm
Z axis: 0.01mm
rotation: 0° bis 360° (0.09°/step)
Placement accuracy: +/- 0.05mm
Repeatability: +/- 0.01 mm
Placement area:
without Waffle Tray: 320x415mm
with 1 Waffle Tray: 320x270mm
Programming:
Direct input
Teach-In by camera
CAD access (option)
Barcode reader (option)
Industrial PC with WIN 10
Power Supply: 230VAC
Power: 700W
Pressure: 75 psi (5.5 bar), max. 100l/min
Machine size: 980x1025x720mm
Machine weight: 165kg
* We reserve the right to make changes without notice.
