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Batch Reflow Oven
The BT301P is ideal for product development, prototypes and small batch production. With the control application based on Android, it is easy to create and save solder profiles. The dynamic control system monitors the size and complexity of the circuit and turns it into an overall process.
Real time temperature monitoring and data acquisition
The BT301P has a modern user interface in which you can work dynamically and in real time. The device can graphically display real-time feedback from the sensors attached directly to the circuit board and / or pass it on to external sources such as a PC or printer.
The real-time temperature profile is created either from the furnace or via the PCB temperature and displayed during the process cycle. The actual values are easy to compare with the set values, which enables precise parameter setting.
The process data can be saved via WiFi connection and used for training purposes, development and quality control.
Usable solder pastes: lead-free and containing lead
PCB mount: 350 x 240 mm
Effective heating area: 250 x 200 mm
Heating method: Quartz infrared tube heating with forced air circulation
Max. Temperature: 310 ° C
Temperature control: Closed PID temperature control loop in real time
Warm-up phase: approx. 2 min
Computer control: built-in dual core CPU with on-board computer
Display: 7 "touch screen with high resolution LCD display
Temperature setting display: temperature profile display in real time
Temperature profile printout: using WiFi
Data backup: external data backup using WiFi
Power supply: 400V, 3-phase, 50/60 Hz, 30A
Power: 3600W (6300W peak)
Dimensions: 690 mm x 470 mm x 270 mm (L x W x H)
Weight: approx. 45 kg
*We reserve the right to make changes without notice.