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SMD - PICK & PLACE MACHINE
The models BA389P3X-V and BA389P3X-V-CY were specially developed for the fast and highly precise loading of large batch sizes. These models are equipped with an optical centering system that enables image processing directly on the placement head "Vision on the Fly". It guarantees the optimal measurement of SMD components such as 0201, SOIC, PLCC, BGA, uBGA, CSP & QFP as well as odd-shaped components up to a grid of 0.3 mm.
Alignment "on the Fly"
Using a sophisticated camera and prism mechanism, components up to 16x14mm footprint are measured directly on the head. This eliminates the trip to the stationary camera.
Components larger than 16x14mm are measured using an optional "bottom vision" camera. Component sizes up to 150x100mm are possible on this stationary camera.
The removal area can be equipped with any number of different feed units. From auto tape feeders to IC trays.
Different methods are available for programming. Tailored to your needs using Teach-In or CAD conversion. Of course, a barcode system can also be used.
Number of heads (Vision on the Fly): 3
Placement rate: 12000 cph, 10500 cph (IPC 9850)
Feeder capacity (8mm): up to 160 Tape Feeder
IC Tray capacity: up to 3 Waffle Trays
Component sense: vision detection
handle by head camera:
smallest: 0.6 x 0.3mm
largest: 150 x 100mm
handle by fixed bottom vision camera (option):
smallest: 0.4 x 0.2mm (option)
largest: 150 x 100mm
X/Y Axis: 0.005mm
Z Axis: 0.01mm
rotation: 0° bis 360° (0.09°/step)
Placement accuracy: +/- 0.03mm
Repeatability: +/- 0.01 mm
Placement area w/o conveyor:
without Waffle Tray: 650x460mm
with 1 Waffle Tray: 650x380mm
Teach-In by camera
CAD access (option)
Barcode reader (option)
Industrial PC with WIN 10
Power Supply: 230VAC
Pressure: 75 psi (5.5 bar), max. 300l/min
Machine size: 1300x1420x1460mm
Machine weight: 1100kg
* We reserve the right to make changes without notice.